Issues in junction-to-case thermal characterization of power packages with large surface area

Contributor - Author	Vass-Várnai, András
Contributor - Author	Shan Gao
Contributor - Author	Sárkány, Zoltán
Contributor - Author	Jongman Kim
Contributor - Author	Seogmoon Choi
Contributor - Author	Farkas, Gábor
Contributor - Author	Poppe, András
Contributor - Author	Kerecsen Istvánné Rencz, Márta
Date - Accessioned	2016-09-04T21:33:21Z
Date - Available	2016-09-04T21:33:21Z
Date - Issued	2010
Identifier - URI	http://hdl.handle.net/10890/3896
Language - ISO	en
Publisher	IEEE Press
Title	Issues in junction-to-case thermal characterization of power packages with large surface area
Type	könyvrészlet
Container Identifier ISBN	978-1-4244-9458-3
Container Title	Proceedings of the 26th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'10)
Identifier - MTMT	2652535
Identifier - Scopus	77952649606
Identifier - Web of Science	000287362700023
Other - Container MTMT	2652533
Type Type	konferenciaközlemény

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