Thermal characterization of multi-die packages
| Poppe, András | ||
| Y Zhang | ||
| Farkas, Gábor | ||
| H Won | ||
| J Wilson | ||
| Szabó, Péter | ||
| 2016-09-04T21:29:38Z | ||
| 2016-09-04T21:29:38Z | ||
| 2006 | ||
| http://hdl.handle.net/10890/2549 | ||
| en | ||
| IEEE Press | ||
| Thermal characterization of multi-die packages | ||
| könyvrészlet | ||
| 1-4244-0664-1 | ||
| Proceedings of the 8th Electronics Packaging Technology Conference (EPTC'06) | ||
| 2613647 | ||
| 50249110221 | ||
| 000245279600084 | ||
| 2613644 | ||
| konferenciaközlemény |
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