THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards

Contributor - Author	Székely, Vladimir
Contributor - Author	Poppe, András
Contributor - Author	Kerecsen Istvánné Rencz, Márta
Contributor - Author	Rosental M
Contributor - Author	Teszeri T
Date - Accessioned	2016-09-04T21:29:03Z
Date - Available	2016-09-04T21:29:03Z
Date - Issued	2000
Identifier - URI	http://hdl.handle.net/10890/2384
Language - ISO	en
Title	THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards
Type	folyóiratcikk
Container Identifier ISSN	0026-2714
Container Periodical Number	3
Container Periodical Volume	40
Container Title	MICROELECTRONICS RELIABILITY
Identifier - MTMT	2606997
Identifier - Scopus	0342656550
Identifier - Web of Science	000086005000013
Type Type	szakcikk

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