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1. Tudományos közlemények, publikációk
BME PA dokumentumai
THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards
THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards
Files
Primary
5044.pdf
(600.12 KB)
Date
2000
Title
THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards
Authors
Székely, Vladimir
Poppe, András
Kerecsen Istvánné Rencz, Márta
Rosental M
Teszeri T
Type
folyóiratcikk
ISSN, e-ISSN
0026-2714
Periodical Number
3
Periodical Volume
40
Container Title
MICROELECTRONICS RELIABILITY
Gender
szakcikk
Cite this item
http://hdl.handle.net/10890/2384
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