Embedded Thick-Film Resistors Applied in Low Temperature Co-fired Ceramic Circuit Substrates

Abstract

The materials that are used to create low temperature co-fired ceramics (LTCC) circuits (produced from green tape andvarious pastes) can be processed by the equipment of the con-ventional thick-film technology (screen printing machine, dryingand burning ovens). The equipment needed to produce multi-layer boards (sinter press, tools, punching machine or Nd-YAGlaser) can be purchased with a little investment. At the sametime the high temperature co-fired ceramics (HTCC) technologyrequires completely new equipment, so the changeover is harderand more expensive. An LTCC test-circuit was designed andrealized by using the thick-film technology equipment at the De-partment of Electronics Technology, BME. The surface and em-bedded resistors were made from thick-film paste. In the courseof the realization and with circuit measurements it could be de-termined what have to be considered at the pre-calculation ofthe resistor values.