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Now showing items 1-10 of 17

Development of a platform independent electro-thermal simulator

Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Mezei G; Prókai T (TIMA Laboratory, 2001)

Electro-thermal simulation for the prediction of chip operation within the package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; K Torki; B Courtois (IEEE Press, 2003)

New methods and supporting tools for the thermal transient testing of packages

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)

Thermal and Thermo-Mechanical Characterization of Movable-Structures and Their Packages

Perlaky, Gergely Gábor; Bognár, György; Szűcs, Zoltán; Szabó, Péter; Horváth, Gyula; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta (2005)

Increasing the accuracy of structure function based evaluation of thermal transient measurements

Kerecsen Istvánné Rencz, Márta; Poppe, András; Kollár, Ernő; Ress, Sándor László; Székely, Vladimir; B Courtois (2004)

Cross-Verification of Thermal Characterisation of a Micro-Cooler

Kohári, Zsolt; Bognár, György; Kollár, Ernő; Horváth, Gyula; Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir (2005)

Inclusion of RC compact models of packages into board level thermal simulation tools

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; B Courtois (IEEE, 2002)

A Methodology for the Co-simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András (2007)

Thermal Characterization and Modeling of Stacked Die Packages

Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; Courtois B (2005)

THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards

Székely, Vladimir; Poppe, András; Kerecsen Istvánné Rencz, Márta; Rosental M; Teszeri T (2000)