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Anadig - An Educational Chip for VLSI Device Characterization

Piwowarska E; Kuzmicz W; Farkas, Gábor; Poppe, András; Hristov M; Manolov E; Weber B; Butas J; Jablonski G; Jarosz A; Kos A; Golda A; Dlugosz R (2007)

Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

New methods and supporting tools for the thermal transient testing of packages

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)

Thermal Characterization and Modeling of Stacked Die Packages

Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; Courtois B (2005)

Thermal Investigation of High Power Optical Devices by Transient Testing

Farkas, Gábor; Q van Voorst Vader; Poppe, András; Bognár, György (2005)

Multi-domain simulation and measurement of power LED-s and power LED assemblies

Poppe, András; Farkas, Gábor; Székely, Vladimir; Horváth, György Gábor; Kerecsen Istvánné Rencz, Márta (2006)

Thermal measurement and modeling of multi-die packages

Poppe, András; Y Zhang; J Wilson; Farkas, Gábor; Szabó, Péter; J Parry (2006)

Electrical, thermal and optical characterization of power LED assemblies

Poppe, András; Farkas, Gábor; Horváth, György Gábor (2006)

Thermal characterization of multi-die packages

Poppe, András; Y Zhang; Farkas, Gábor; H Won; J Wilson; Szabó, Péter (IEEE Press, 2006)

Short time die attach characterization of LEDs for in-line testing application

Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Farkas, Gábor; Poppe, András (IEEE Press, 2006)