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Now showing items 1-10 of 23

Development of a platform independent electro-thermal simulator

Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Mezei G; Prókai T (TIMA Laboratory, 2001)

Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Electro-thermal simulation for the prediction of chip operation within the package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; K Torki; B Courtois (IEEE Press, 2003)

New methods and supporting tools for the thermal transient testing of packages

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)

Thermal and Thermo-Mechanical Characterization of Movable-Structures and Their Packages

Perlaky, Gergely Gábor; Bognár, György; Szűcs, Zoltán; Szabó, Péter; Horváth, Gyula; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta (2005)

Increasing the accuracy of structure function based evaluation of thermal transient measurements

Kerecsen Istvánné Rencz, Márta; Poppe, András; Kollár, Ernő; Ress, Sándor László; Székely, Vladimir; B Courtois (2004)

Cross-Verification of Thermal Characterisation of a Micro-Cooler

Kohári, Zsolt; Bognár, György; Kollár, Ernő; Horváth, Gyula; Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir (2005)

Evaluation Issues of Thermal Measurements Based on the Structure Functions

Kerecsen Istvánné Rencz, Márta; Kollár, Ernő; Poppe, András; Ress, Sándor László (2003)

Inclusion of RC compact models of packages into board level thermal simulation tools

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; B Courtois (IEEE, 2002)

A Methodology for the Co-simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András (2007)