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New Way for Thermal Transient Testing

Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Poppe, András; B Courtois (IEEE, 1998)

Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Studying the Influence of Chip Temperatures on Timing Integrity Using Improved Power Modeling

Timár, András; Kerecsen Istvánné Rencz, Márta (2011)

Electro-thermal co-simulation of ICs with runtime back-annotation capability

Timár, András; Bognár, György; Poppe, András; Kerecsen Istvánné Rencz, Márta (EDA Publishing, 2010)

Improved power modeling in logi-thermal simulation

Timár, András; Bognár, György; Kerecsen Istvánné Rencz, Márta (IEEE Press, 2011)

High Resolution Temperature Dependent Timing Model in Digital Standard Cell Designs

Timár, András; Kerecsen Istvánné Rencz, Márta (2013)

Logi-thermal simulation using high-resolution temperature dependent delay models

Timár, András; Kerecsen Istvánné Rencz, Márta (Brandenburgische Technische Universität Cottbus, 2013)

Thermal evaluation of the SIP9 package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Kohári, Zsolt; Ress, Sándor László; Páhi András; Poppe, András (TIMA Laboratory, 1999)

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Poppe, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta; Benedek, Zsolt; Páhi András; Székely, Vladimir; Torki K; Mir S; Courtois Bernard (TIMA Laboratory, 2000)

Transient thermal measurements for dynamic package modeling: new approaches

Székely, Vladimir; Ress, Sándor László; Poppe, András; Török, Sándor; Magyari D; Benedek, Zsolt; Courtois Bernard; Kerecsen Istvánné Rencz, Márta (TIMA Laboratory, 1999)

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