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Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Poppe, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta; Benedek, Zsolt; Páhi András; Székely, Vladimir; Torki K; Mir S; Courtois Bernard (TIMA Laboratory, 2000)

Development of a platform independent electro-thermal simulator

Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Mezei G; Prókai T (TIMA Laboratory, 2001)

Thermal Characterisation of a Radial-Channel Micro-Cooler Plate

Horváth, Gyula; Bognár, György; Kohári, Zsolt; A J Pang; M P Y Desmulliez; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta (2005)

Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits

Poppe, András; Horváth, György Gábor; Nagy, Gergely; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir (2008)

Vibration combined high temperature cycle tests for capacitive MEMS accelerometers

Szűcs, Zoltán; Nagy, Gergely; Hodossy, Sándor; Kerecsen Istvánné Rencz, Márta; Poppe, András (2007)

Simulation of Comb Drive for Fracture Lifetime Measurements

Somlay, Gergely László; Szűcs, Zoltán; Poppe, András; Kerecsen Istvánné Rencz, Márta (2007)

Simulation of Comb Drive for Fracture Lifetime Measurements

Somlay, Gergely László; Szűcs, Zoltán; Poppe, András; Kerecsen Istvánné Rencz, Márta (2007)

Electro-thermal simulation for the prediction of chip operation within the package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; K Torki; B Courtois (IEEE Press, 2003)

New methods and supporting tools for the thermal transient testing of packages

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)

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Package characterization: simulations or measurements?

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Development of a platform independent electro-thermal simulator

Thermal Characterisation of a Radial-Channel Micro-Cooler Plate

Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits

Vibration combined high temperature cycle tests for capacitive MEMS accelerometers

Simulation of Comb Drive for Fracture Lifetime Measurements

Simulation of Comb Drive for Fracture Lifetime Measurements

Electro-thermal simulation for the prediction of chip operation within the package

New methods and supporting tools for the thermal transient testing of packages