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New Way for Thermal Transient Testing

Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Poppe, András; B Courtois (IEEE, 1998)

Thermal evaluation of the SIP9 package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Kohári, Zsolt; Ress, Sándor László; Páhi András; Poppe, András (TIMA Laboratory, 1999)

Transient thermal measurements for dynamic package modeling: new approaches

Székely, Vladimir; Ress, Sándor László; Poppe, András; Török, Sándor; Magyari D; Benedek, Zsolt; Courtois Bernard; Kerecsen Istvánné Rencz, Márta (TIMA Laboratory, 1999)

An alternative method for electro-thermal circuit simulation

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; A Páhi; Poppe, András (IEEE Press, 1999)

Thermal investigation of large digital integrated circuits

G Hajas; A Páhi; Sz Hajder; Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir ([s. n.], 1998)

CAD Tools and Foundries to Boost Microsystems Development

Courtois B; Karam JM; Lubaszewski M; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Hofmann K; Glesner M (1998)

Electro-thermal and logi-thermal simulation of VLSI designs

Székely, Vladimir; Poppe, András; Páhi A; Csendes A; Hajas G; Kerecsen Istvánné Rencz, Márta (1997)

Electro-thermal simulation: a realization by simultaneous iteration

Székely, Vladimir; Poppe, András; Kerecsen Istvánné Rencz, Márta; Csendes A; Páhi A (1997)

CAD and Foundries for Microsystems

J M Karam; B Courtois; H Boutamine; P Drake; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; K Hofmann; M Glesner (1997)

Structural and algorithmic questions of a platform independent electro-thermal simulator

Székely, Vladimir; Poppe, András; Kerecsen Istvánné Rencz, Márta; A Páhi; Sz Hajder; G Hajas (1998)