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New Way for Thermal Transient Testing

Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Poppe, András; B Courtois (IEEE, 1998)

Thermal evaluation of the SIP9 package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Kohári, Zsolt; Ress, Sándor László; Páhi András; Poppe, András (TIMA Laboratory, 1999)

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Poppe, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta; Benedek, Zsolt; Páhi András; Székely, Vladimir; Torki K; Mir S; Courtois Bernard (TIMA Laboratory, 2000)

Transient thermal measurements for dynamic package modeling: new approaches

Székely, Vladimir; Ress, Sándor László; Poppe, András; Török, Sándor; Magyari D; Benedek, Zsolt; Courtois Bernard; Kerecsen Istvánné Rencz, Márta (TIMA Laboratory, 1999)

Development of a platform independent electro-thermal simulator

Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Mezei G; Prókai T (TIMA Laboratory, 2001)

Thermal Characterisation of a Radial-Channel Micro-Cooler Plate

Horváth, Gyula; Bognár, György; Kohári, Zsolt; A J Pang; M P Y Desmulliez; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta (2005)

Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits

Poppe, András; Horváth, György Gábor; Nagy, Gergely; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir (2008)

Electro-thermal simulation for the prediction of chip operation within the package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; K Torki; B Courtois (IEEE Press, 2003)

New methods and supporting tools for the thermal transient testing of packages

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)

An alternative method for electro-thermal circuit simulation

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; A Páhi; Poppe, András (IEEE Press, 1999)