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New Way for Thermal Transient Testing
(IEEE, 1998)
Thermal evaluation of the SIP9 package
(TIMA Laboratory, 1999)
Transient thermal measurements for dynamic package modeling: new approaches
(TIMA Laboratory, 1999)
Development of a platform independent electro-thermal simulator
(TIMA Laboratory, 2001)
New methods and supporting tools for the thermal transient testing of packages
(Nanyang Technological University, 2001)
An alternative method for electro-thermal circuit simulation
(IEEE Press, 1999)