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New Way for Thermal Transient Testing

Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Poppe, András; B Courtois (IEEE, 1998)

Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Electro-thermal co-simulation of ICs with runtime back-annotation capability

Timár, András; Bognár, György; Poppe, András; Kerecsen Istvánné Rencz, Márta (EDA Publishing, 2010)

Thermal evaluation of the SIP9 package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Kohári, Zsolt; Ress, Sándor László; Páhi András; Poppe, András (TIMA Laboratory, 1999)

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Poppe, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta; Benedek, Zsolt; Páhi András; Székely, Vladimir; Torki K; Mir S; Courtois Bernard (TIMA Laboratory, 2000)

Transient thermal measurements for dynamic package modeling: new approaches

Székely, Vladimir; Ress, Sándor László; Poppe, András; Török, Sándor; Magyari D; Benedek, Zsolt; Courtois Bernard; Kerecsen Istvánné Rencz, Márta (TIMA Laboratory, 1999)

Development of a platform independent electro-thermal simulator

Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Mezei G; Prókai T (TIMA Laboratory, 2001)

New simulation approaches supporting temperature-aware design of digital ICs

Nagy, Gergely; Timár, András; Szalai, Albin; Kerecsen Istvánné Rencz, Márta; Poppe, András (IEEE, 2012)

Comparison of JEDEC Dynamic and Static Test Methods for Thermal Characterization of Power LEDs

Vass-Várnai, András; John Parry; Gergely Toth; Ress, Sándor László; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta (2012)

A Novel Approach of Logi-thermal Simulation Methodology and Implementation for ASIC Designs

Timár, András; Poppe, András; Kerecsen Istvánné Rencz, Márta (IEEE Press, 2010)

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