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A Methodology for the Co-simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András (2007)

Thermal Characterization and Modeling of Stacked Die Packages

Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; Courtois B (2005)

Thermal Investigation of High Power Optical Devices by Transient Testing

Farkas, Gábor; Q van Voorst Vader; Poppe, András; Bognár, György (2005)

Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Courtois B (NIIN Computational Publications, 2003)

Simulation of Comb Drive for Fracture Lifetime Measurements

Somlay, Gergely László; Szűcs, Zoltán; Poppe, András; Kerecsen Istvánné Rencz, Márta (2007)

Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits

Poppe, András; Horváth, György Gábor; Nagy, Gergely; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir (2008)

Thermal Investigation of High Power Optical Devices by Transient Testing

Farkas, Gábor; Q van Vorst Vader; Poppe, András; Bognár, György (2003)

The Sissy Electro-Thermal Simulation System - Based on Modern Software Technologies

Horváth, György Gábor; Poppe, András (2005)

Vibration combined high temperature cycle tests for capacitive MEMS accelerometers

Szűcs, Zoltán; Nagy, Gergely; Hodossy, Sándor; Kerecsen Istvánné Rencz, Márta; Poppe, András (2007)

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Poppe, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta; Benedek, Zsolt; Páhi András; Székely, Vladimir; Torki K; Mir S; Courtois Bernard (TIMA Laboratory, 2000)

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A Methodology for the Co-simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

Thermal Characterization and Modeling of Stacked Die Packages

Thermal Investigation of High Power Optical Devices by Transient Testing

Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems

Simulation of Comb Drive for Fracture Lifetime Measurements

Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits

Thermal Investigation of High Power Optical Devices by Transient Testing

The Sissy Electro-Thermal Simulation System - Based on Modern Software Technologies

Vibration combined high temperature cycle tests for capacitive MEMS accelerometers

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement