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Now showing items 91-100 of 101

A General Multi-domain LED Model and its Validation by Means of AC Thermal Impedance

Poppe, András; Temesvölgyi, Tamás (IEEE Press, 2013)

Testing of power LEDs: The latest thermal testing standards from JEDEC

Poppe, András (2013)

Measuring AC Thermal Impedance of LEDs and Assessment of LM80 Test Results

Poppe, András; Gábor Molnár; Farkas, Gábor; Temesvölgyi, Tamás; Marosy, Gábor Elemér; Kovács, Zoltán György (Luger Research e.U; Institute for Innovation and Technology, 2011)

A Novel Simulation Environment Enabling Multilevel Power Estimation of Digital Systems

Nagy, Gergely; Poppe, András (IEEE Press, 2011)

Thermal evaluation of the SIP9 package

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Kohári, Zsolt; Ress, Sándor László; Páhi András; Poppe, András (TIMA Laboratory, 1999)

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Poppe, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta; Benedek, Zsolt; Páhi András; Székely, Vladimir; Torki K; Mir S; Courtois Bernard (TIMA Laboratory, 2000)

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A General Multi-domain LED Model and its Validation by Means of AC Thermal Impedance

Testing of power LEDs: The latest thermal testing standards from JEDEC

Measuring AC Thermal Impedance of LEDs and Assessment of LM80 Test Results

A Novel Simulation Environment Enabling Multilevel Power Estimation of Digital Systems

Thermal evaluation of the SIP9 package

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Transient thermal measurements for dynamic package modeling: new approaches

Development of a platform independent electro-thermal simulator

Integrating Advanced Interconnect Technologies in a High Power Lighting Application: First Steps

Practical aspects of thermal transient testing in live digital circuits

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A General Multi-domain LED Model and its Validation by Means of AC Thermal Impedance

Testing of power LEDs: The latest thermal testing standards from JEDEC

Measuring AC Thermal Impedance of LEDs and Assessment of LM80 Test Results

A Novel Simulation Environment Enabling Multilevel Power Estimation of Digital Systems

Thermal evaluation of the SIP9 package

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Transient thermal measurements for dynamic package modeling: new approaches

Development of a platform independent electro-thermal simulator

Integrating Advanced Interconnect Technologies in a High Power Lighting Application: First Steps

Practical aspects of thermal transient testing in live digital circuits