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New Way for Thermal Transient Testing

Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Poppe, András; B Courtois (IEEE, 1998)

Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Studying the Influence of Chip Temperatures on Timing Integrity Using Improved Power Modeling

Timár, András; Kerecsen Istvánné Rencz, Márta (2011)

Simulation of Comb Drive for Fracture Lifetime Measurements

Somlay, Gergely László; Szűcs, Zoltán; Poppe, András; Kerecsen Istvánné Rencz, Márta (2007)

Electro-thermal co-simulation of ICs with runtime back-annotation capability

Timár, András; Bognár, György; Poppe, András; Kerecsen Istvánné Rencz, Márta (EDA Publishing, 2010)

Studying the influence of chip temperatures on timing integrity

Timár, András; Kerecsen Istvánné Rencz, Márta (IEEE Press, 2011)

Issues in junction-to-case thermal characterization of power packages with large surface area

Vass-Várnai, András; Shan Gao; Sárkány, Zoltán; Jongman Kim; Seogmoon Choi; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta (IEEE Press, 2010)

CAD and Foundries for Microsystems

J M Karam; B Courtois; H Boutamine; P Drake; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; K Hofmann; M Glesner (1997)

Structural and algorithmic questions of a platform independent electro-thermal simulator

Székely, Vladimir; Poppe, András; Kerecsen Istvánné Rencz, Márta; A Páhi; Sz Hajder; G Hajas (1998)

Applied design and analysis of microsystems

J M Karam; B Courtois; K Hofmann; M Glesner; Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir (1996)

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