Author Vass-Várnai, András
Author Shan Gao
Author Sárkány, Zoltán
Author Jongman Kim
Author Seogmoon Choi
Author Farkas, Gábor
Author Poppe, András
Author Kerecsen Istvánné Rencz, Márta
Date accessioned 2016-09-04T21:33:21Z
Date available 2016-09-04T21:33:21Z
Date of issue 2010
URI of identifier http://hdl.handle.net/10890/3896
Language en
Publisher IEEE Press
Title Issues in junction-to-case thermal characterization of power packages with large surface area
Document type könyvrészlet
Identifiers [mtmt] 2652535
Identifiers [scopus] 77952649606
Identifiers [wos] 000287362700023
ISBN, e-ISBN 978-1-4244-9458-3
Other container identifier 2652533
Title of the container document Proceedings of the 26th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'10)
Document genre konferenciaközlemény
