Issues in junction-to-case thermal characterization of power packages with large surface area

Title: Issues in junction-to-case thermal characterization of power packages with large surface area
Author: Vass-Várnai, András; Shan Gao; Sárkány, Zoltán; Jongman Kim; Seogmoon Choi; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta
Date of issue: 2010
Publisher: IEEE Press
Language: en
Identifiers: MTMT: 2652535; Scopus: 77952649606; Web of Science: 000287362700023
Title of the container document: Proceedings of the 26th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'10)
ISBN, e-ISBN: 978-1-4244-9458-3
Document type: könyvrészlet
Document genre: konferenciaközlemény