Issues in junction-to-case thermal characterization of power packages with large surface area

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- BME PA dokumentumai [3590]
- Title
- Issues in junction-to-case thermal characterization of power packages with large surface area
- Author
- Vass-Várnai, András
- Shan Gao
- Sárkány, Zoltán
- Jongman Kim
- Seogmoon Choi
- Farkas, Gábor
- Poppe, András
- Kerecsen Istvánné Rencz, Márta
- Date of issue
- 2010
- Publisher
- IEEE Press
- Language
- en
- Identifiers
- MTMT: 2652535
- Scopus: 77952649606
- Web of Science: 000287362700023
- Title of the container document
- Proceedings of the 26th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'10)
- ISBN, e-ISBN
- 978-1-4244-9458-3
- Document type
- könyvrészlet
- Document genre
- konferenciaközlemény