Issues in junction-to-case thermal characterization of power packages with large surface area

Thumbnail
View/Open
Metadata
Show full item record
Link to refer to this document:
http://hdl.handle.net/10890/3896
Collections
Title
Issues in junction-to-case thermal characterization of power packages with large surface area
Author
Vass-Várnai, András
Shan Gao
Sárkány, Zoltán
Jongman Kim
Seogmoon Choi
Farkas, Gábor
Poppe, András
Kerecsen Istvánné Rencz, Márta
Date of issue
2010
Publisher
IEEE Press
Language
en
Identifiers
MTMT: 2652535
Scopus: 77952649606
Web of Science: 000287362700023
Title of the container document
Proceedings of the 26th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'10)
ISBN, e-ISBN
978-1-4244-9458-3
Document type
könyvrészlet
Document genre
konferenciaközlemény