Thermal measurement and modeling of multi-die packages

Thumbnail
View/Open
Metadata
Show full item record
Link to refer to this document:
http://hdl.handle.net/10890/2550
Collections
Title
Thermal measurement and modeling of multi-die packages
Author
Poppe, András
Y Zhang
J Wilson
Farkas, Gábor
Szabó, Péter
J Parry
Date of issue
2006
Language
en
Identifiers
MTMT: 2613649
Title of the container document
Proceedings of the 12th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'06)
Document type
egyéb konferenciaközlemény
Document genre
konferenciaközlemény