Electro-thermal simulation for the prediction of chip operation within the package

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Title: Electro-thermal simulation for the prediction of chip operation within the package
Author: Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; K Torki; B Courtois
Date of issue: 2003
Publisher: IEEE Press
Language: en
Identifiers: MTMT: 2613619; Scopus: 0037272235; Web of Science: 000182024200026
Title of the container document: Proceedings of the 19th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'03)
ISBN, e-ISBN: 0-7803-7793-1
Document type: könyvrészlet
Document genre: konferenciaközlemény