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Electro-thermal simulation for the prediction of chip operation within the package

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Link to refer to this document:
http://hdl.handle.net/10890/2541
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  • BME PA dokumentumai [3588]
Title
Electro-thermal simulation for the prediction of chip operation within the package
Author
Kerecsen Istvánné Rencz, Márta
Székely, Vladimir
Poppe, András
K Torki
B Courtois
Date of issue
2003
Publisher
IEEE Press
Language
en
Identifiers
MTMT: 2613619
Scopus: 0037272235
Web of Science: 000182024200026
Title of the container document
Proceedings of the 19th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'03)
ISBN, e-ISBN
0-7803-7793-1
Document type
könyvrészlet
Document genre
konferenciaközlemény

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