Electro-thermal simulation for the prediction of chip operation within the package

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- BME PA dokumentumai [3588]
- Title
- Electro-thermal simulation for the prediction of chip operation within the package
- Author
- Kerecsen Istvánné Rencz, Márta
- Székely, Vladimir
- Poppe, András
- K Torki
- B Courtois
- Date of issue
- 2003
- Publisher
- IEEE Press
- Language
- en
- Identifiers
- MTMT: 2613619
- Scopus: 0037272235
- Web of Science: 000182024200026
- Title of the container document
- Proceedings of the 19th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'03)
- ISBN, e-ISBN
- 0-7803-7793-1
- Document type
- könyvrészlet
- Document genre
- konferenciaközlemény