Author Kerecsen Istvánné Rencz, Márta
Author Székely, Vladimir
Author Poppe, András
Author B Courtois
Date accessioned 2016-09-04T21:29:35Z
Date available 2016-09-04T21:29:35Z
Date of issue 2002
URI of identifier http://hdl.handle.net/10890/2540
Language en
Publisher IEEE
Title Inclusion of RC compact models of packages into board level thermal simulation tools
Document type könyvrészlet
Identifiers [mtmt] 2613612
Identifiers [scopus] 0036214740
Identifiers [wos] 000175370000011
ISBN, e-ISBN 0-7803-7327-8
Other container identifier 2607065
Title of the container document Proceedings of the 18th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'02)
Document genre konferenciaközlemény
