Inclusion of RC compact models of packages into board level thermal simulation tools

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Link to refer to this document:
http://hdl.handle.net/10890/2540
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Title
Inclusion of RC compact models of packages into board level thermal simulation tools
Author
Kerecsen Istvánné Rencz, Márta
Székely, Vladimir
Poppe, András
B Courtois
Date of issue
2002
Publisher
IEEE
Language
en
Identifiers
MTMT: 2613612
Scopus: 0036214740
Web of Science: 000175370000011
Title of the container document
Proceedings of the 18th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'02)
ISBN, e-ISBN
0-7803-7327-8
Document type
könyvrészlet
Document genre
konferenciaközlemény