Thermal Characterization and Modeling of Stacked Die Packages

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Title: Thermal Characterization and Modeling of Stacked Die Packages
Author: Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; Courtois B
Date of issue: 2005
Language: en
Identifiers: MTMT: 2607089; Web of Science: 000241978201100
Title of the container document: Proceedings of the InterPACK'05
Document type: egyéb konferenciaközlemény
Document genre: konferenciaközlemény