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Thermal Characterization and Modeling of Stacked Die Packages

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Link to refer to this document:
http://hdl.handle.net/10890/2389
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  • BME PA dokumentumai [3590]
Title
Thermal Characterization and Modeling of Stacked Die Packages
Author
Szabó, Péter
Kerecsen Istvánné Rencz, Márta
Székely, Vladimir
Poppe, András
Farkas, Gábor
Courtois B
Date of issue
2005
Language
en
Identifiers
MTMT: 2607089
Web of Science: 000241978201100
Title of the container document
Proceedings of the InterPACK'05
Document type
egyéb konferenciaközlemény
Document genre
konferenciaközlemény

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