THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards

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Title: THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards
Author: Székely, Vladimir; Poppe, András; Kerecsen Istvánné Rencz, Márta; Rosental M; Teszeri T
Date of issue: 2000
Language: en
Identifiers: MTMT: 2606997; Scopus: 0342656550; Web of Science: 000086005000013
Title of the container document: MICROELECTRONICS RELIABILITY
Volume of container document: 40
Number of container document: 3
ISSN, e-ISSN: 0026-2714
Document type: folyóiratcikk
Document genre: szakcikk