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Now showing items 31-40 of 56

Electro-thermal simulation: a realization by simultaneous iteration

Székely, Vladimir; Poppe, András; Kerecsen Istvánné Rencz, Márta; Csendes A; Páhi A (1997)

THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards

Székely, Vladimir; Poppe, András; Kerecsen Istvánné Rencz, Márta; Rosental M; Teszeri T (2000)

Issues in junction-to-case thermal characterization of power packages with large surface area

Vass-Várnai, András; Shan Gao; Sárkány, Zoltán; Jongman Kim; Seogmoon Choi; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta (IEEE Press, 2010)

Thermal characterization and modelling of Lithium-based batteries at low ambient temperature

Szente-Varga, Domonkos; Horváth, Gyula; Kerecsen Istvánné Rencz, Márta (EDA Publishing, 2008)

Design of a static TIM tester

Székely, Vladimir; Somlay, Gergely László; Szabó, Péter Gábor; Kerecsen Istvánné Rencz, Márta (EDA Publishing, 2008)

CAD and Foundries for Microsystems

J M Karam; B Courtois; H Boutamine; P Drake; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; K Hofmann; M Glesner (1997)

New methods and supporting tools for the thermal transient testing of packages

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)

An alternative method for electro-thermal circuit simulation

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; A Páhi; Poppe, András (IEEE Press, 1999)

Structural and algorithmic questions of a platform independent electro-thermal simulator

Székely, Vladimir; Poppe, András; Kerecsen Istvánné Rencz, Márta; A Páhi; Sz Hajder; G Hajas (1998)

Thermal investigation of large digital integrated circuits

G Hajas; A Páhi; Sz Hajder; Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir ([s. n.], 1998)