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Now showing items 31-40 of 56

An alternative method for electro-thermal circuit simulation

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; A Páhi; Poppe, András (IEEE Press, 1999)

Thermal investigation of large digital integrated circuits

G Hajas; A Páhi; Sz Hajder; Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir ([s. n.], 1998)

Inclusion of RC compact models of packages into board level thermal simulation tools

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; B Courtois (IEEE, 2002)

Multi-domain simulation and measurement of power LED-s and power LED assemblies

Poppe, András; Farkas, Gábor; Székely, Vladimir; Horváth, György Gábor; Kerecsen Istvánné Rencz, Márta (2006)

Thermal and Thermo-Mechanical Characterization of Movable-Structures and Their Packages

Perlaky, Gergely Gábor; Bognár, György; Szűcs, Zoltán; Szabó, Péter; Horváth, Gyula; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta (2005)

Increasing the accuracy of structure function based evaluation of thermal transient measurements

Kerecsen Istvánné Rencz, Márta; Poppe, András; Kollár, Ernő; Ress, Sándor László; Székely, Vladimir; B Courtois (2004)

Short time die attach characterization of LEDs for in-line testing application

Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Farkas, Gábor; Poppe, András (IEEE Press, 2006)

Cross-Verification of Thermal Characterisation of a Micro-Cooler

Kohári, Zsolt; Bognár, György; Kollár, Ernő; Horváth, Gyula; Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir (2005)

Evaluation Issues of Thermal Measurements Based on the Structure Functions

Kerecsen Istvánné Rencz, Márta; Kollár, Ernő; Poppe, András; Ress, Sándor László (2003)

CAD Tools and Foundries to Boost Microsystems Development

Courtois B; Karam JM; Lubaszewski M; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Hofmann K; Glesner M (1998)