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Now showing items 1-10 of 14

Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Anadig - An Educational Chip for VLSI Device Characterization

Piwowarska E; Kuzmicz W; Farkas, Gábor; Poppe, András; Hristov M; Manolov E; Weber B; Butas J; Jablonski G; Jarosz A; Kos A; Golda A; Dlugosz R (2007)

Joint Electric and Thermal Characterisation of High Power Optical Devices

Bognár, György; Szabó, Péter; Farkas, Gábor; Poppe, András ([s. n.], 2004)

Complex characterization of power LEDs: simultaneous measurement of photometric/radiometric and thermal properties

Farkas, Gábor; Poppe, András; J Schanda; K Muray (International Commission on Illumination (CIE), 2004)

Multi-domain simulation and measurement of power LED-s and power LED assemblies

Poppe, András; Farkas, Gábor; Székely, Vladimir; Horváth, György Gábor; Kerecsen Istvánné Rencz, Márta (2006)

Thermal measurement and modeling of multi-die packages

Poppe, András; Y Zhang; J Wilson; Farkas, Gábor; Szabó, Péter; J Parry (2006)

Electrical, thermal and optical characterization of power LED assemblies

Poppe, András; Farkas, Gábor; Horváth, György Gábor (2006)

Thermal characterization of multi-die packages

Poppe, András; Y Zhang; Farkas, Gábor; H Won; J Wilson; Szabó, Péter (IEEE Press, 2006)

Short time die attach characterization of LEDs for in-line testing application

Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Farkas, Gábor; Poppe, András (IEEE Press, 2006)

New methods and supporting tools for the thermal transient testing of packages

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)