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New Way for Thermal Transient Testing 

Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Poppe, András; B Courtois (IEEE, 1998)
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CAD and Foundries for Microsystems 

J M Karam; B Courtois; H Boutamine; P Drake; Poppe, András; Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; K Hofmann; M Glesner (1997)
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Applied design and analysis of microsystems 

J M Karam; B Courtois; K Hofmann; M Glesner; Poppe, András; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir (1996)
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CAD of MEMS: from the idea to the reality 

J M Karam; B Courtois; K Hofmann; Poppe, András; Kerecsen Istvánné Rencz, Márta; M Glesner; Székely, Vladimir (1996)
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Increasing the accuracy of structure function based evaluation of thermal transient measurements 

Kerecsen Istvánné Rencz, Márta; Poppe, András; Kollár, Ernő; Ress, Sándor László; Székely, Vladimir; B Courtois (2004)
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Electro-thermal simulation for the prediction of chip operation within the package 

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; K Torki; B Courtois (IEEE Press, 2003)
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New methods and supporting tools for the thermal transient testing of packages 

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)
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Inclusion of RC compact models of packages into board level thermal simulation tools 

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; B Courtois (IEEE, 2002)

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B Courtois (8)
Kerecsen Istvánné Rencz, Márta (8)
Poppe, András (8)
Székely, Vladimir (8)
J M Karam (3)K Hofmann (3)M Glesner (3)Farkas, Gábor (1)H Boutamine (1)K Torki (1)... View MoreDate Issued1996 (2)1997 (1)1998 (1)2001 (1)2002 (1)2003 (1)2004 (1)Has File(s)Yes (8)

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