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Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Issues in junction-to-case thermal characterization of power packages with large surface area

Vass-Várnai, András; Shan Gao; Sárkány, Zoltán; Jongman Kim; Seogmoon Choi; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta (IEEE Press, 2010)

Multi-domain simulation and measurement of power LED-s and power LED assemblies

Poppe, András; Farkas, Gábor; Székely, Vladimir; Horváth, György Gábor; Kerecsen Istvánné Rencz, Márta (2006)

Short time die attach characterization of LEDs for in-line testing application

Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Farkas, Gábor; Poppe, András (IEEE Press, 2006)

New methods and supporting tools for the thermal transient testing of packages

Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; B Courtois (Nanyang Technological University, 2001)

Thermal Characterization and Modeling of Stacked Die Packages

Szabó, Péter; Kerecsen Istvánné Rencz, Márta; Székely, Vladimir; Poppe, András; Farkas, Gábor; Courtois B (2005)

Comparison of JEDEC Dynamic and Static Test Methods for Thermal Characterization of Power LEDs

Vass-Várnai, András; John Parry; Gergely Toth; Ress, Sándor László; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta (2012)

Design of a scalable multifunctional thermal test die with direct and boundary scan access for programmed excitation and data measurement

Poppe, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta; Benedek, Zsolt; Páhi András; Székely, Vladimir; Torki K; Mir S; Courtois Bernard (TIMA Laboratory, 2000)