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Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Issues in junction-to-case thermal characterization of power packages with large surface area

Vass-Várnai, András; Shan Gao; Sárkány, Zoltán; Jongman Kim; Seogmoon Choi; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta (IEEE Press, 2010)

Comparison of JEDEC Dynamic and Static Test Methods for Thermal Characterization of Power LEDs

Vass-Várnai, András; John Parry; Gergely Toth; Ress, Sándor László; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta (2012)