Search

Now showing items 1-10 of 100

Hot Topic for LEDs: Standardization Issues of Thermal Characterization

Poppe, András; Clemens J M Lasance (2009)

New Way for Thermal Transient Testing

Székely, Vladimir; Kerecsen Istvánné Rencz, Márta; Poppe, András; B Courtois (IEEE, 1998)

Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

A 3D Monte Carlo semiconductor device simulator for submicron silicon MOS structures

K Tarnay; F Masszi; Poppe, András; P Verhás; T Kocsis; Kohári, Zsolt (Computational Mechanics Publications, 1993)

Issues of Thermal Testing of AC LEDs

Poppe, András; Bernie Siegal; Farkas, Gábor (IEEE, 2011)

Anadig - An Educational Chip for VLSI Device Characterization

Piwowarska E; Kuzmicz W; Farkas, Gábor; Poppe, András; Hristov M; Manolov E; Weber B; Butas J; Jablonski G; Jarosz A; Kos A; Golda A; Dlugosz R (2007)

How thermal environment affects OLEDs’ operational characteristics?

Kohári, Zsolt; Pohl, László; Poppe, András (IEEE, 2012)

A step forward in multi-domain modeling of power LEDs

Poppe, András (IEEE, 2012)

Joint Electric and Thermal Characterisation of High Power Optical Devices

Bognár, György; Szabó, Péter; Farkas, Gábor; Poppe, András ([s. n.], 2004)

Simulation of Comb Drive for Fracture Lifetime Measurements

Somlay, Gergely László; Szűcs, Zoltán; Poppe, András; Kerecsen Istvánné Rencz, Márta (2007)

1
2
3
4
. . .
10