Search

Now showing items 1-10 of 21

Package characterization: simulations or measurements?

Poppe, András; Vass-Várnai, András; Farkas, Gábor; Kerecsen Istvánné Rencz, Márta (IEEE, 2008)

Issues of Thermal Testing of AC LEDs

Poppe, András; Bernie Siegal; Farkas, Gábor (IEEE, 2011)

Anadig - An Educational Chip for VLSI Device Characterization

Piwowarska E; Kuzmicz W; Farkas, Gábor; Poppe, András; Hristov M; Manolov E; Weber B; Butas J; Jablonski G; Jarosz A; Kos A; Golda A; Dlugosz R (2007)

Joint Electric and Thermal Characterisation of High Power Optical Devices

Bognár, György; Szabó, Péter; Farkas, Gábor; Poppe, András ([s. n.], 2004)

Issues in junction-to-case thermal characterization of power packages with large surface area

Vass-Várnai, András; Shan Gao; Sárkány, Zoltán; Jongman Kim; Seogmoon Choi; Farkas, Gábor; Poppe, András; Kerecsen Istvánné Rencz, Márta (IEEE Press, 2010)

Complex characterization of power LEDs: simultaneous measurement of photometric/radiometric and thermal properties

Farkas, Gábor; Poppe, András; J Schanda; K Muray (International Commission on Illumination (CIE), 2004)

Multi-domain simulation and measurement of power LED-s and power LED assemblies

Poppe, András; Farkas, Gábor; Székely, Vladimir; Horváth, György Gábor; Kerecsen Istvánné Rencz, Márta (2006)

Thermal measurement and modeling of multi-die packages

Poppe, András; Y Zhang; J Wilson; Farkas, Gábor; Szabó, Péter; J Parry (2006)

Electrical, thermal and optical characterization of power LED assemblies

Poppe, András; Farkas, Gábor; Horváth, György Gábor (2006)

Thermal characterization of multi-die packages

Poppe, András; Y Zhang; Farkas, Gábor; H Won; J Wilson; Szabó, Péter (IEEE Press, 2006)